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ASE Technology Holding Co., Ltd. (ASX)

NYSE - NYSE Delayed Price. Currency in USD
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7.42+0.21 (+2.91%)
At close: 04:00PM EST
7.43 +0.01 (+0.13%)
After hours: 06:28PM EST

ASE Technology Holding Co., Ltd.

26 Chin Third Road
Nantze Export Processing Zone Nantze
Kaohsiung 811
Taiwan
886 7 361 7131
http://www.aseglobal.com

Sector(s)Technology
IndustrySemiconductors
Full-time employees104,471

Key executives

NameTitlePayExercisedYear born
Mr. Gilles BenhamouChief Exec. OfficerN/AN/A1954
Mr. Hung-Pen ChangVice Chairman, GM & PresN/AN/A1947
Mr. Joseph TungCFO & Representative DirectorN/AN/A1959
Dr. Tien Yu WuCOO & Representative DirectorN/AN/A1958
Mr. Dtuang WangGroup Chief Accounting Officer & Corp. Governance OfficerN/AN/AN/A
Mr. Du-Tsuen UangGroup Chief Admin. Officer, Corp. Governance Officer & Company Sec.N/AN/A1960
Mr. Kenneth HsiangHead of Investor Relations & VPN/AN/A1971
Dr. Shi Hua PanGroup Chief of StaffN/AN/A1945
Mr. Rui Rong LoGM of Kaohsiung Plant & Representative DirectorN/AN/A1955
Mr. Kwai Mun LeePres of Southeast Asia OperationsN/AN/A1963
Amounts are as of 31 December 2016, and compensation values are for the last fiscal year ending on that date. Pay includes salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in USD.

Description

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. The company offers packaging services, including flip chip ball grid array (BGA), flip chip chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various package types; and copper and silver wire bonding solutions. It also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, the company offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, it provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, the company develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, financing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. ASE Technology Holding Co., Ltd. was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

Corporate governance

ASE Technology Holding Co., Ltd.’s ISS governance QualityScore as of N/A is N/A. The pillar scores are Audit: N/A; Board: N/A; Shareholder rights: N/A; Compensation: N/A.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while 10 indicates higher governance risk.