|Mr. Hung-Pen Chang||Vice Chairman, GM & Pres||N/A||N/A||1947|
|Mr. Joseph Tung||CFO & Representative Director||N/A||N/A||1959|
|Dr. Tien Yu Wu||COO & Representative Director||N/A||N/A||1958|
|Mr. Dtuang Wang||Group Chief Accounting Officer & Corp. Governance Officer||N/A||N/A||N/A|
|Mr. Ducun Wang||Chief Admin. Officer, Chief Corp. Governance Officer & Company Sec.||N/A||N/A||1960|
|Mr. Kenneth Hsiang||Head of Investor Relations & VP||N/A||N/A||1971|
|Dr. Shi Hua Pan||Group Chief of Staff||N/A||N/A||1945|
|Mr. Rui Rong Lo||GM of Kaohsiung Plant & Representative Director||N/A||N/A||1955|
|Mr. Kwai Mun Lee||Pres of Southeast Asia Operations||N/A||N/A||1963|
|Mr. Bo-Lian Li||Sr. VP||N/A||N/A||N/A|
ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.
ASE Technology Holding Co., Ltd.’s ISS governance QualityScore as of N/A is N/A. The pillar scores are Audit: N/A; Board: N/A; Shareholder rights: N/A; Compensation: N/A.