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ANSYS, Inc. (ANSS)

NasdaqGS - NasdaqGS Real-time price. Currency in USD
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319.52+4.99 (+1.59%)
At close: 04:00PM EDT
320.01 +0.49 (+0.15%)
After hours: 05:30PM EDT
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Trade prices are not sourced from all markets
Previous close314.53
Open313.87
Bid319.11 x 200
Ask319.88 x 100
Day's range313.87 - 323.70
52-week range258.01 - 364.31
Volume477,982
Avg. volume475,761
Market cap27.894B
Beta (5Y monthly)1.15
PE ratio (TTM)64.16
EPS (TTM)N/A
Earnings dateN/A
Forward dividend & yieldN/A (N/A)
Ex-dividend dateN/A
1y target estN/A
  • GlobeNewswire

    Ansys Announces Q1 Financial Results

    / Q1 2024 Results Revenue of $466.6 millionGAAP diluted earnings per share of $0.40 and non-GAAP diluted earnings per share of $1.39GAAP operating profit margin of 9.3% and non-GAAP operating profit margin of 32.2%Operating cash flows of $282.8 million and unlevered operating cash flows of $292.7 millionAnnual Contract Value (ACV) of $407.4 millionDeferred revenue and backlog of $1,369.5 million on March 31, 2024 PITTSBURGH, May 01, 2024 (GLOBE NEWSWIRE) -- ANSYS, Inc. (NASDAQ: ANSS), today repo

  • PR Newswire

    TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips

    Ansys (NASDAQ: ANSS) today announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs. RaptorX is now certified for TSMC's N5 technology — crucial for modeling on-chip electromagnetic integrity in radio frequency systems, 5G, telecommu

  • PR Newswire

    Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

    Ansys (NASDAQ: ANSS) today announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.