BRIEF-Toppan: To Build New Flip Chip Ball Grid Array (FC-BGA) Substrate Plant In Singapore, Aims To Start Production In End-2026
March 14 (Reuters) - TOPPAN Holdings Inc:
* TOPPAN - TO BUILD NEW FLIP CHIP BALL GRID ARRAY (FC-BGA) SUBSTRATE PLANT IN SINGAPORE, AIMS TO START PRODUCTION IN END-2026 Source text: https://www.holdings.toppan.com/ja/news/2024/03/newsrelease240314_1.html Further company coverage: (Reporting by Kantaro Komiya)