BRIEF-Nikkei Says Japan's Toppan To Build Singapore Chip Package Substrate Plant
March 13 (Reuters) -
* JAPAN'S TOPPAN TO BUILD SINGAPORE CHIP PACKAGE SUBSTRATE PLANT - NIKKEI
* TOPPAN TO BEGIN OPERATIONS AT END OF 2026 AT SINGAPORE CHIP PACKAGE SUBSTRATE PLANT - NIKKEI
* TOPPAN'S INVESTMENT IN SINGAPORE PLANT ESTIMATED AT 50 BILLION YEN - NIKKEI Further company coverage: