Toppan Photomask, the world's premier semiconductor photomask provider, announced that it has entered into a joint research and development agreement with IBM related to the 2 nanometer (nm) logic semiconductor node, using extreme ultraviolet (EUV) lithography. This agreement also includes High-NA EUV photomask development capability on next-generation semiconductors.
Toppan Leefung Pte. Ltd. is pleased to announced its new brand as TOPPAN NEXT PTE. LTD. ("TOPPAN NEXT"). This significant transformation reflects the next chapter for the strategic growth platform headquartered in Singapore, reflecting its ongoing commitment to innovation and technology leadership in high-risk digital and physical information & products.