Advanced Micro Devices, Inc (NASDAQ:AMD) signed a contract with Samsung Electronics (OTC:SSNLF) to supply HBM3E (5th generation high bandwidth memory) valued at approximately $3 billion (4 trillion won for its new data center chip, the MI350. Samsung Electronics has agreed to provide AMD with 12-layer HBM3E DRAM, slated for mass production in the year’s first half. Samsung started supplying samples to customers in February. The deal is worth about $3 billion (KRW 4.134 trillion), Viva 100 report
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SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced a collaboration with MetisX to develop a Compute Express Link (CXL)-based memory accelerator chip. The aim of this collaboration is to design the prototype and develop the mass product by applying Samsung Foundry's 4nm process technology, optimized for high-performance computing (HPC).