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Amkor Technology, Inc. (AMKR)

NasdaqGS - NasdaqGS Real Time Price. Currency in USD
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19.37+0.63 (+3.36%)
At close: 4:00PM EDT

Amkor Technology, Inc.

2045 East Innovation Circle
Tempe, AZ 85284
United States
480 821 5000

Full-time employees29,050

Key executives

NameTitlePayExercisedYear born
Mr. James J. KimExec. Chairman2.6MN/A1936
Mr. Giel RuttenPres, CEO & Director2.01M498.82k1957
Ms. Megan FaustExec. VP & CFO985.27k413.26k1974
Mr. Mark N. RogersExec. VP, Gen. Counsel & Corp. Sec.1.09MN/A1966
Mr. John Charles StoneExec. VP & Chief Sales Officer1.2M151.6k1957
Mr. YoungKuk ParkExe. VP of Worldwide Manufacturing Ops. & Pres of Amkor Technology Korea, Inc.759.91kN/A1959
Ms. Jennifer JueSr. Director of Investor Relations and Fin.N/AN/AN/A
Mr. Steve ShinExec. VP of Worldwide Manufacturing OperationsN/AN/AN/A
Mr. Mike LiangPres of Taiwan OperationsN/AN/AN/A
Amounts are as of 31 December 2020, and compensation values are for the last fiscal year ending on that date. Pay includes salary, bonuses, etc. Exercised is the value of options exercised during the fiscal year. Currency in USD.


Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; and flip chip ball grid array products for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Corporate governance

Amkor Technology, Inc.’s ISS governance QualityScore as of 30 April 2021 is 4. The pillar scores are Audit: 1; Board: 4; Shareholder rights: 4; Compensation: 7.

Corporate governance scores courtesy of Institutional Shareholder Services (ISS). Scores indicate decile rank relative to index or region. A decile score of 1 indicates lower governance risk, while 10 indicates higher governance risk.