STATS ChipPAC Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services. It offers various semiconductor packaging services, such as standard plastic, small and thin packages, flip chip bonding, system-in-packaging, advanced stacked die, and multi-chip and multi-package assembly services. The company’s packaging services support various package technologies, including wafer level products; flip chip packages; copper wirebond packages; ball grid array and fine pitch ball grid array packages; quad flat no-lead and bump chip carrier packages; quad flat pack and thin small outline packages; system-in-package; 3d packages; and memory cards. It also provides a suite of solutions and test platforms comprising test facilities, test platforms, wafer sort, test development services, RF test, mixed signal test, memory test, high-end digital test, strip test, final test, and post test solutions, as well as integrated test management system. In addition, the company offers turnkey test and packaging capabilities for wafer bumping related processes, including wafer bumping and redistribution services, full turnkey services for advanced flip chip applications, and turnkey services for wafer level chip scale packages. The company markets its services through direct sales force in the United States, South Korea, Japan, China, Singapore, Malaysia, Taiwan, and Switzerland. STATS ChipPAC Ltd. was founded in 1994 and is headquartered in Singapore.

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